XE01-2011

￭ Passive Kühllösung bei 26 mm Höhe

￭ Kupferlamellen und Kupferbasis

￭ Intel-LGA-2011/2066-kompatibel

Bottom view showing pre-applied thermal compound

Bottom view showing pre-applied thermal compound
Mounting screw close-up view

Mounting screw close-up view
Close up view of skived copper heatsink fins

Close up view of skived copper heatsink fins
Installed on motherboard

Installed on motherboard
 

Spezifikationen

Modell Nr. SST-XE01-2011
Gehäuse Material Kupfer
Anwendung Intel LGA2011 / 2066
Nettogewicht 486g
Abmessung 90mm (B) x 26mm (H) x 90mm (T)

PICTURES

Right side view Left side view Front side view Back side view Retail package
 




  • Downloads
  • Empfehlungen
  • Testberichte
  • F & A


Describe Ver Größe Download
XE01-2011 Hochauflösende Fotos 9,899 KB
XE01-2011 Anleitung V1 1,715 KB
XE01-2011 eDM (xe01-2011-edm-de.jpg)   775 KB


There are no recommend items for this product.

No such information.